Advances In 3d Integrated Circuits And Systems
Series on Emerging Technologies in Circuits and Systems
Yu, Hao
Tan, Chuan Seng
- 出版社：World Scientific Publishing Co Pte Ltd
- 出版年月：2015年 08月
- ISBN：9789814699013
- 装丁：PAP
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装丁について
- 言語：ENG
- 巻数・ページ数：392 p.
- 分類： 電子回路
- DDC分類：621.3815
- 内容紹介：
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Contents include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs,; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.